BONDING PROCESS CAPABILITY
Category:
Product Description
| Project | Process Capability |
| Minimum Order Quantity(MOQ) | For orders exceeding 60,000 points,pricing is calculated per point;for orders below 60,000 points,a one-time setup fee will be charged. |
| Lead Time | 5-day lead time for small/medium batches |
| Process Steps/Manufacturing Process | Die Attach-Wire Bonding-Inspection -Encapsulation-Baking |
| Aluminum Wire | RoHS compliant,minimum wire diameter 0.7-1.25 mil(≈0.17-0.31mm),with pullstrength ≥7g. |
| Component Services | ODM with materials |
| Accuracy &Resolution | The XY resolution can reach 0.0246mm(0.625μm).The minimum PAD size is 2mil(50μm)with a minimum PAD pitch of 10μm. |
| Package Parameters | The minimum underfillheight is IC height +0.25mm.The first-pass wire bonding yield rate exceeds 98%,with a defect rate controlled within 0.5%(excluding incoming material quality issues). The placement speed reaches0.2 seconds per chip,with a placement accuracy of±0.1mm. |
| Application Scope | Component size is 0603 or larger. |
| Specialized Processes | Supports half-hole process with minimum hole diameter of 0.5mm and board thickness tolerance±5%(T≥1.0mm). |
| PCB Board Types | PCB rigid board,aluminum base board |
| Bonding PCB Dimensions | Minimum board size:50mm x 50mm Maximum board size:250mm x 330mm |
| Maximum Thick Board | 0.4-6.0mm |
Key words:
BONDING PROCESS CAPABILITY
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Printed circuit board, abbreviated as PCB, is one of the important components in the electronics industry
Printed circuit board, abbreviated as PCB, is one of the important components in the electronics industry
Printed circuit board, abbreviated as PCB, is one of the important components in the electronics industry
Printed circuit board, abbreviated as PCB, is one of the important components in the electronics industry
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