Product Description

ProjectProcess Capability
Number of Layers1 layer
Board Material TypeAluminum base board
Board Material BrandGuoji
Board Thickness0.8/1.0/1.2/1.5/2.0mm
Board Thickness ToleranceT≥1.0mm,±10%/T<1.0mm,±0.1mm
Finished Outer 
Copper Thickness
18um/25um/35um/70um(0.50Z/0.75OZ/10Z/2OZ)
Solder Mask TypePhotosensitive ink /thermosetting ink
Solder Mask ColorGreen oil,white oil,black oil,blue oil,yellow oil,red oil,matte green/black oil
Silkscreen ColorWhite,black
Surface FinishRosin,anti-oxidation(OSP),leaded/lead-free HASL(HASL/LF-HASL),ENIG(electroless nickel immersion gold)
Maximum Board SizeStandard:480x580mm,limit:580x1180mm
Panelization MethodManufacturing processes:CNC(Computer Numerical Control),V-CUT,punching
Outline Dimension AccuracyCNC ±0.2mm, V-CUT ±0.15mm,die punching ±0.15mm
Minimum Trace Width/SpacingTrace width:8mil (0.2mm), with some areas allowing 6mil (0.15mm)minimum
ProjectProcess Capability
Trace-to-outline ClearanceFor routed boards,maintain a minimum clearance of≥0.3mm(12mil)between routing traces and the board outline.For V-cut panels,ensure≥0.4mm(16mil)minimum clearance between routing traces and the V-cut centerline.
Minimum Drill Hole SizeCNC±0.2mm,V-CUT±0.15mm,die punching±0.15mm
Via annular ring(single side)≥16mil(0.4mm)
Hole size tolerance±0.1mm
Minimum Character SizeWidth≥0.15mm,Height≥1.0mm
PanelizationThe gap between panels should not be less than 2.0mm,otherwise routing will be difficult.
Solder Mask BridgeFor solder mask colors green,red,or blue,pad spacing must be ≥8mil(0.2mm);for other colors,≥10mil(0.25mm).

Key words:

SINGLE-SIDED ALUMINUM SUBSTRATE PROCESS CAPABILITY

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