Product Description

PCB surface finish immersion gold process is a widely used finishing method in PCB manufacturing that deposits a thin, uniform layer of gold over a nickel barrier on copper pads. This process improves solderability, oxidation resistance, and electrical contact stability, making it suitable for fine-pitch components and high-reliability electronics. It is commonly applied in communication devices, industrial control systems, and automotive electronics where long-term performance and signal integrity are critical requirements in production environments.

Key words:

Immersion Gold Process

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